SVM
Support Vector Machine
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TCP
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Topological Close‐Packed
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TEM
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Transverse Electromagnetic Modes
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TGM
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Temperature Gradient Mechanism
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Ti
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Titanium
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TiC
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Titanium Carbide
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Ti‐HA
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Titanium‐Hydroxyapatite
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TMCs
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Titanium‐Matrix Composites
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TN
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True Negative
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TP
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True Positive
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TPMS
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Triply Periodic Minimal Surface
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TRL
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Technology Readiness Level
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TTT
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Transformation Time Temperature
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VC
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Vanadium Carbides
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VED
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Volumetric Energy Density
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VoF
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Volume‐of‐Fluid
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VTM
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Virtual Temperature Method
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WF
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Wire‐Fed
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WF‐EDED
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Wire‐Fed Electron Beam Directed Energy Deposition
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XRD
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X‐Ray Diffraction
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XRF
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X‐Ray Fluorescence
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YAG
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Yttrium Aluminum Garnet
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YLF
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Yttrium Lithium Fluoride
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YVO4
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Yttrium Orthovanadate
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Nomenclature
Unless otherwise stated in the text, these symbols have the following meanings
aCharacteristic lengthaEnergy bilinear function for internal energy (Chapter 10)ASpot area – heat source interaction areaAFilament or nozzle cross‐section area (Chapter 7)AatAttenuated areaAcCross‐section areaIntersection of melt pool area on substrate and powder streamAjetCross‐section of powder stream on substrateAGProperty of filament materialAij, BijEinstein coefficientsASSurface areabMelt pool depthbBias (Chapter 11)BSize of gap (Chapter 7)BMagnetic fieldBDifferential shape function matrix (Chapter 10)cSpeed of lightcpHeat capacitycylFunction based on Bessel functionscsSpeed of sound in the fluidCDuty cycleCCompliance (Chapter 10)CaCapillary numberCsSolid compositionCLLiquid compositionCNominal alloy composition or solute concentrationdSpot sizedEuclidean distance (Chapter 11)dDroplet diameterd3, 2Surface mean particle diameterdconSemispherical dropletDLaser beam diameterDMaterial matrixDfDiffusion constantDijmnTensor of elastic coefficientsDLSolute diffusion coefficientDØDiffusion coefficienteWhen subscript or superscript, signifies a variable in its elemental formeiVector pointingELaser beam energyEElectric field (Chapter 5)EYoung’s modulus matrix (Chapter 10)EaEnergy of activationEbE‐beam energyEiInput laser energyEkinKinetic energyErReflected energyEtTransmitted energyEiEnergy levels (Chapter 3)EspecificThe energy enters the substrate from the surface in DEDfFrequencyfVolume fraction (Chapter 10)fsFraction of solidfLFraction of liquidf(R)Function of surface roughnessfi(x, t)Density of particles moving in the ei directionEquilibrium distributionFForceFFourier numberZero‐order Bessel function of its first kindThe first‐order Bessel function of the first kindFCapCapillary forceFstSurface tension forceFthThermal stress loadFWetWetting forcegGravitygiEffect of external forcesGTemperature gradientGSGibbs free energy for solidGLGibbs free energy for liquidGzGraetz numberΔGTotal Gibbs free energy changeΔG*Critical free energy changeΔGVFree energy change per unit volumehPlank's constant (Chapter 3)hHeight of a hexahedral element (Chapter 10)hcHeat convection coefficienthiConvective heat loss (cooling) coefficientshaAverage heat transfer coefficient of convectionhwDistance between the nozzle and surfacehrRadiative heat transfer coefficient hminMinimum radius of the liquid columnHBarrel length or height of trackH*Height of the melt polymer∆HEnthalpy differenceHDRHeating depth ratioIIntensity: energy per areaICurrent in electron beam (Chapter 5)I(x)Indicator function (Chapter 11)IIntensity scale factor or initial intensityIbBeam current in the electron‐beam processJFree electron currentkPropagation factorkEquilibrium distribution coefficient (Chapter 8)kSolute partition coefficient (Chapter 9)KThermal conductivityKGlobal stiffness matrix (Chapter 10)KcConductivity matrix (Chapter 10)KhConnective matrix (Chapter
