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SEPIC and quadratic boost converters with a boosting stage, which increases the boosting factor of converter. The continuous input-current as well as large boosting capability make the proposed topology applicable for Photovoltaic (PV) applications.

      Chapter 20 proposes two novel basic configurations for switched-capacitor-based 13- and 17-level inverters, with high step-up capability and self-voltage balancing of capacitors.

      Fabrication and Manufacturing Process of Solar Cell: Part I

       S. Dwivedi

       S.S. Jain Subodh P.G. (Autonomous) College, Jaipur, India

       Abstract

      Crystalline silicon solar cell (c-Si) based technology has been recognized as the only environment-friendly viable solution to replace traditional energy sources for power generation. It is a cost-effective, renewable and long-term sustainable energy source. The Si-based technology has a market growth of almost 20-30% and is projected to attain an energy share of ~100 giga watt (GW) per year in the current fiscal year, 2020. There have been constant efforts in reducing manufacturing cost of solar panel technology, which is about three-four times higher in comparison to traditional carbon-based fuels. In the manufacturing domain, fabrication of three basic c-Si solar cell configurations can be utilized, which are differentiated in the manner of generation of electron-hole (E-H) pairs on exposure to sunlight. The generation of electricity by impinging light on a semiconductor material requires production of electrons and holes such that electrons in the valence band become free and jump to the conduction band by absorbing energy. Thus, jumping of highly energetic electrons to different material generates an electromotive force (EMF) converting light energy into electrical signals. This is known as the photovoltaic (PV) effect.

      This chapter is an effort to outline fabrication processes and manufacturing methodologies for commercial production of large area PV modules as an alternative green source of energy.

      Keywords: Solar cell, photovoltaics, p-n junction, photovoltaic panels, crystalline silicon solar cell, renewable energy, physics of solar cell, fabrication of solar cell

      There has always been a surge to discover newer sources of energy which can be effective alternatives for the orthodox sources of energy, such as, petrol, kerosene, wind energy, thermal power generators [1,2]. In this quest, the sun is a natural huge source of renewable green energy. It is noteworthy that the terrestrial soil is exposed to an enormous amount of solar energy as large as about ten thousand times of all the energy used around the globe. The terrestrial hemisphere facing the sun receives power in excess of 50,000 terawatt (TW) in each instance, which makes reception of an enormous amount of energy possible [3]. Photovoltaics (PV) technology is a technology that relies on this infinite source of sunlight and possesses inherent qualities of highly reduced service costs since the sun provides free energy, reliability, noiseless, minimum maintenance costs and readily installation features [4, 5].

      1.1.1 Introduction to Si-Based Fabrication Technology

      Photovoltaics technology is a green method of energy production which is based on fabrication and manufacturing of solar cells on platform of Si wafers [9]. In this regard, it is mandatory to know about the Si wafers. So the silicon and its geometry as an integral component of the solar cell technology will be discussed first.

Schematic illustration of different radiations occurring from the sun which consists of direct, diffuse and reflected radiations.

      Silicon is a member of group 14 in the periodic table and is tetravalent metalloid, semiconductor and brittle crystalline solid [10-12]. In 1906, a silicon radio crystal detector was developed as the first silicon-based semiconductor device by Greenleaf Whittier Pickard [13]. Russell Ohl discovered the nonlinear semiconductor devices, p-n junction, and photovoltaic effect in the metalloid Si in 1940 [14]. In 1941, during the Second World War, radar microwave detectors were invented by developing techniques for production of high quality germanium (Ge) and Si crystals [15]. William Shockley proposed a field-effect amplifier based on Ge and Si in 1947, but could not demonstrate the prototype practically [16]. John Bardeen and Walter Brattain built the first working device, point-contact transistor, in 1947 under the direction of Shockley only [17]. The first Si-based junction transistor was fabricated by the physical chemist Morris Tanenbaum in 1954 at Bell Labs [18]. At Bell Labs in 1954, Carl Frosch and Lincoln Derick found out by accident that it is possible to grow silicon-di-oxide (SiO2) on Si wafers [19]. Later on, in 1958, they discovered that this as-grown SiO2 could be used to mask Si surfaces during diffusion processes [19].

      Si atom has fourteen electrons with electronic configuration 2,8,4 [1s2, 2s2, 2p6, 3s2, 3p2] specifying that the number of valence electrons is 4 [10,11]. These valence electrons occupy the 3s orbital and two 3p orbitals. In order to complete its octet and attain the stable noble gas configuration of Argon (Ar), it can combine with other elements to form SiX4 derivatives by forming sp3 hybrid orbitals. In this case, the central Si atom taking part in the bonding with other element shares an electron pair with each of the four atoms of the bonding element.