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(c)–(e) Reproduced with permission. [39] Copyright 2009, Elsevier Ltd.

      In short, melt blending is a simple method to fabricate CPCs. The electrical properties of the CPCs are strongly dependent on the processing parameters like mixing time, shear stress, and temperature as well as the surface modification and introduction of compatibilizers.

      2.2.2 Solution Blending

      Although melt blending is a useful and feasible processing method for the large-scale industrial production of the CPCs, the volume concentration of conductive particles is usually higher than 5% to obtain the composite with a high conductivity [45]. Such a high content of fillers would largely increase the melt viscosity [46, 47] and thus make the processing less smooth and also increase the cost of the material fabrication. As an alternative, solution mixing method can tackle this issue, because the nanofillers can be diluted in solvent to achieve relatively good dispersion [48, 49].

      Solution mixing refers to a process for preparation of CPCs through mixing conductive elements and polymer matrix in a solvent, followed by cooling and solvent removal. Generally, this fabrication process contains three key steps: (i) preparation of filler suspension in a suitable solvent, (ii) mixing filler suspension with polymer, and (iii) precipitation or solvent evaporation of the mixed solution. While the majority of conductive fillers, especially carbon-based fillers (e.g. CNTs, graphene, and carbon black) show undesired dispersion in organic solvent due to their large specific surface area and high degree of graphitization thus low surface energy. Herein, it is difficult to get a uniformly dispersed suspension of carbon-based fillers just by mechanical stirring. Thus, powerful ultrasonication is often adopted to assist the nanofiller dispersion in a polymer solution [50–52]. In many cases, chemical modification or the dispersant is required. For instance, acid (such as sulfuric and/or nitric) is often used to modify the CNTs, and the graphitized structure of the CNTs is partially damaged and oxygen containing functional groups can be grafted onto the filler surface through covalent bonding [53, 54]. These functional groups can effectively promote the nanofiller dispersion in the solution due to the interaction (e.g. hydrogen bond) between fillers and solvent [16, 55].

(a, b) The PEO/DNA nanofiber webs containing 5% DNA-dispersed DWNTs. (c) Stress–strain curves for nanofiber webs of pure PEO, PEO/DNA, and PEO/DNA/DWNT. Source: (a)–(c) Reproduced with permission. [57] Copyright 2013, American Chemical Society.

      2.2.3 In Situ Polymerization

      In situ polymerization was firstly proposed by Imai et al. where polyimide (PI)/CB composite was obtained by dispersing the CB into the polymer salt monomer [66]. In fact, this is a unique solution based processing technology for preparing the CPCs, and chemical reaction is usually involved during the polymerization [67, 68]. The efficient polymer-chain graft onto the filler surface could form a perfect interface interaction between the filler and polymer matrices, which also improves the homogeneous dispersion of the fillers in the polymer matrix and influences the crystallization of polymer chains to some extent [69–71]. As a result, CPCs with a high weight content of the nanofillers can be obtained by this method [69, 72].

      Zhu and coworkers prepared reduced graphene oxide (r-GO)/PI composites with different loadings of GO by in situ polymerization and the maximum content of GO can reach 30 wt%. During polymerization, a relatively high temperature was set to reduce GO into conductive r-GO in the polymer matrix. The electrical property of the obtained r-GO/PI was greatly enhanced, because of the conductive network formed by r-GO in the composite film and the conductivity could reach as high as 1.1 × 101 S m−1, which is about 1014 times that of pure PI film [73]. The mechanical properties of GO/PMMA composites