Fault Detection and Classification
|
|
FOUP
|
Front Opening Unified Pod
|
|
FICS
|
Free Internet Chess Server
|
|
GEDs
|
Generic Embedded Devices
|
|
GEM
|
Generic Equipment Model
|
|
GH
|
Generic Holon
|
|
GUI
|
Graphical User Interface
|
|
HMES
|
Holonic Manufacturing Execution System
|
|
HSCS
|
Holonic Supply‐Chain System
|
|
HSMS
|
High‐Speed SECS Message Services
|
|
IC
|
Integrated Circuit
|
|
ICT
|
Information and Communication Technology
|
|
iFA
|
Intelligent Factory Automation
|
|
IoT
|
Internet of Things
|
|
IP
|
Internet Protocol Address
|
|
IPM
|
Intelligent Predictive Maintenance
|
|
ISMT
|
International SEMATECH
|
|
IT
|
Information Technology
|
|
ITRS
|
International Technology Roadmap of Semiconductor
|
|
IYM
|
Intelligent Yield Management
|
|
KSA
|
Key‐variable Search Algorithm
|
|
L2L
|
Lot‐to‐Lot
|
|
MC
|
Mass Customization
|
|
MCS
|
Material Control System
|
|
MES
|
Manufacturing Execution System
|
|
MP
|
Mass Production
|
|
MPS
|
Master Production Schedule
|
|
NACFAM
|
National Coalition for Advanced Manufacturing
|
|
O2D
|
Order‐to‐Delivery
|
|
OEE
|
Overall Equipment Effectiveness
|
|
PdM
|
Predictive Maintenance
|
|
PO
|
Purchase Order
|
|
R2R
|
Run‐to‐Run
|
|
RD
|
Research and Development
|
|
RDL
|
Re‐Distribution Layer
|
|
RM
|
Recipe Management
|
|
RUL
|
Remaining Useful Life
|
|
SC
|
Supply Chain
|
|
SECS
|
SEMI Equipment Communications Standard
|
|
SOAP
|
Simple Object Access Protocol
|
|
SPC
|
Statistical Process Control
|
|
SSL
|
Secure Sockets Layer
|
|
T2M
|
Time‐to‐Market
|
|
tsmc
|
Taiwan Semiconductor Manufacturing Company
|
|
UBM
|
Under Bump Metallurgy
|
|
VM
|
Virtual Metrology
|
|
W2W
|
Wafer‐to‐Wafer
|
|
W2W
|
Workpiece‐to‐Workpiece
|
|
WIP
|
Work in Process
|
|
WSDL
|
Web Services Description Language
|
|
YES
|
Yield Enhancement System
|
|
YMS
|
Yield Management System
|
|
ZD
|
Zero Defects
|
References
1 1 SEMATECH (1998). Computer Integrated Manufacturing (CIM) Framework Specification Version 2.0. SEMATECH Technology Transfer # # 93061697J‐ENG. https://bit.ly/3hDCvJH (accessed 27 Aug 2020).
2 2 Cheng, F.‐T., Shen, E., Deng, J.‐Y. et al. (1999). Development of a system framework for the computer‐integrated manufacturing execution system: a distributed object‐oriented approach. International Journal of Computer Integrated Manufacturing 12 (5): 384–402. https://doi.org/10.1080/095119299130137.
3 3 Cheng, F.‐T., Chang, C.‐F., and Wu, S.‐L. (2004). Development of holonic manufacturing execution systems. Journal of Intelligent Manufacturing 15 (2): 253–267. https://doi.org/10.1023/B:JIMS.0000018037.63935.a1.
4 4 International SEMATECH (2002). Equipment Engineering Capabilities (EEC) guidelines, v2.5. https://reurl.cc/Q3dR2o (accessed 17 Aug 2020).
5 5 Su, Y.‐C., Cheng, F.‐T., Hung, M.‐H. et al. (2006). Intelligent prognostics system design and implementation. IEEE Transactions on Semiconductor Manufacturing 19 (2): 195–207. https://doi.org/10.1109/TSM.2006.873512.
6 6 Harrison, P. (2015). An introduction to supply chain management. https://reurl.cc/Y61Yv0 (accessed 17 Aug 2020).
7 7 NEVEM‐workgroup (1989). Performance Indicators in Logistics. Bedford: IFS.
8 8 Cheng, F.‐T., Yang, H.‐C., and Lin, J.‐Y.
